The 2nd Cyber-Physical Learning Alliance Summit (CPLAS 2025) will bring together researchers, faculty members, industry professionals, and decision-makers from around the world to explore evolving practices and innovations in cyber-physical learning (CPL). Hosted by the Hong Kong University of Science and Technology (HKUST), CPLAS 2025 aims to foster international collaboration, share cutting-edge practices, and push the boundaries of CPL.
This year’s theme, "Connecting Minds, Technology, and Learning Spaces", will focus on pivotal topics including Artificial Intelligence, Learning Analytics, Human-Centric Learning, Engagement in Immersive Learning, and the Ethics of CPL. Attendees will have the opportunity to participate in collaborative workshops, design-thinking sessions, immersive learning activities, and discussions, all aimed at enhancing the understanding and impact of CPL in educational contexts.
Organized by the Cyber-Physical Learning Alliance (CPLA), which was founded in 2023 with current members including Aalto University (Finland), Bentley University (USA), the Hong Kong University of Science and Technology (Hong Kong), NEOM University (Saudi Arabia), Singapore University of Technology and Design (Singapore), Tecnológico de Monterrey (Mexico), The University of Ottawa (Canada), and Zhejiang University (China), CPLAS 2025 will serve as a key platform for advancing CPL research and implementation.
The summit will be held in person at the Hong Kong University of Science and Technology on June 4th and 5th, 2025.
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